摘要：MEMS器件封装时,为了给具有活动装置的MEMS器件提供足够的空间,需要在封装的帽层上刻蚀出V形腔结构.本文利用V形槽工艺,制作出适合于硅片上大面积MEMS芯片封装用V形腔阵列.SEM照片表明,所做V形腔阵列结构整齐,图形清晰.
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