摘要:随着电子产业无铅化进程的推进,Sn-Ag—Cu(SAC)系无铅钎料备受关注。然而目前市场主流SAC钎料Ag含量(质量分数,3%)较高,导致其成本高,焊点的脆性较大,所以开发低银无铅钎料十分必要。文中以新型低银SAC系钎料为研究载体,对低银无铅微焊点界面金属间化合物(IMC)演变行为及微观力学性能进行了研究.
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