摘要：采用Bc方式等径弯曲通道变形(ECAP)对超低碳钢进行了4道次变形,对不同道次的显微组织与硬度进行了分析与测定.结果表明:经4道次ECAP变形后出现等轴亚微米晶粒,晶粒平均尺寸达到0.3μm;显微组织主要为具有大角度晶界的等轴晶组织;硬度随变形道次的增加而提高.
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Acta Mathematicae Applicatae Sinica Journal of Genetics and Genomics Acta Biochimica et Biophysica Sinica Journal of Systems Engineering and Electronics Chinese Annals of Mathematics Series B Chinese Annals of Mathematics,Series B Frontiers of Information Technology Electronic Engineering Transactions of Nonferrous Metals Society of China