摘要:功率半导体模块封装是加工过程中一个非常关键的环节。分析传统模块封装技术,新型模块封装技术方案。研究适合国内芯片的封装工艺,通过协同设计提高芯片封装良品率和可靠性。
注:因版权方要求,不能公开全文,如需全文,请咨询杂志社
热门期刊服务
Acta Geologica Sinica Acta Metallurgica Sinica Acta Geologica Sinica High Technology Letters Acta Oceanologica Sinica Chinese Geographical Science Acta Pharmacologica Sinica Journal of Geographical Sciences Journal of Meteorological Research Journal of Wuhan University of Technology Science China Technological Sciences Journal of Huazhong University of Science and Technology