摘要:美国Aviza科技公司和澳大利亚SEZ集团日前就在利用ALD(Atomic Layer Deposition,原子层沉积)技术形成高介电常数(high-k)膜时,对附着在晶圆顶端或背面而造成组件污染的薄膜进行清除的技术达成了合作协议。
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