摘要:采用溶胶凝胶方法在Si(100)衬底上生长了SrBi2Ta2O9/LaNiO3(SBT/LNO)异质结薄膜,其中SrBi2Ta2O9薄膜呈高度(115)取向.测量了不同退火温度下异质结的电滞回线和漏电流密度,结果表明,700℃下退火的薄膜剩余极化值最高,漏电流最低,且表现出弱的室温铁磁行为.漏电流机理分析表明薄膜界面为欧姆接触.
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