摘要:文中采用ANAND焊点本构关系模型描述了Sn60Pb40焊层蠕变行为,通过MARC有限元软件模拟了电子封装器件Sn60Pb40焊层在热循环中的蠕变过程,研究了Sn60Pb40焊层的蠕变应变最大值出现的位置,分析了封装结构热失配和焊层厚度对Sn60Pb40焊层蠕变应变的影响。结果表明:焊层边角处最早发生蠕变断裂,降低封装结构热失配程度和优化焊层厚度均可减小Sn60Pb40焊层的蠕变变形。该研究结果不仅为封装结构的热匹配优化设计提供了新的思路,也为预测焊层蠕变断裂位置和优化工艺提供了技术支持。
注:因版权方要求,不能公开全文,如需全文,请咨询杂志社
热门期刊服务
Science China Technological Sciences Transactions of Nonferrous Metals Society of China Biomedical and Environmental Sciences Research in Astronomy and Astrophysics Plasma Science and Technology Journal of Environmental Sciences The Journal of China Universities of Posts and Telecommunications Journal of Systematics and Evolution Journal of Materials Science Technology Journal of Mountain Science Tsinghua Science and Technology Progress in Natural Science:Materials International