摘要:该计划旨在提供技术和产品来改善碳化硅的性能和可用性,以满足电动汽车,电信和工业应用不断增长的需求。法国贝尔宁一设计和制造创新半导体材料的行业领导者Soitec(巴黎泛欧交易所)宣布了与Applied Materials联合开发下一代碳化硅衬底的计划。对碳化硅基芯片的需求一直在增长,特别是在电动汽车,电信和工业应用中。
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